M6 High Speed Low Loss Multilayer Printed Circuit Board (Megtron 6 PCB)

(Printed Circuit Boards are custom-made products; the images and parameters shown are for reference only)

Product Overview

Introducing the M6 High Speed Low Loss Multilayer Printed Circuit Board, specifically the R-5775 model. Megtron 6 is engineered for exceptional performance in mobile, networking, and wireless applications, characterized by its ultra-low loss and high heat resistance.

Key Properties

Low Dielectric Constant (Dk): 3.7 (@ 1GHz)
Low Dielectric Dissipation Factor (Df): 0.002 (@ 1GHz)
Enhanced Reliability: Excellent through-hole reliability, outperforming conventional high Tg FR-4 materials by five times.
Compliance: Lead-free and ROHS-compliant soldering.
High Heat Resistance: Designed to withstand elevated temperatures
High-Density Interconnect (HDI): Outstanding thermal performance and interconnect capabilities.

PCB Capabilities (Megtron 6)

PCB Capability (Megtron6)
PCB Material:	Low DK Glass Cloth
Designation:	Laminate R-5775(G), Prepreg R-5670(G)
Dielectric constant:	3.61 10GHz
Dissipation Factor	0.004 10GHz
Layer count:	Multilayer PCB, Hybrid PCB
Copper weight:	1oz (35µm), 2oz (70µm)
PCB thickness:	0.